Bisphenol A
Product Description
| Product | Bisphenol A |
| CAS | 80-05-7 |
| Formula | C15H16O2 |
| Synonym | bisphenol, bisferol A, BPA, DIAN, DPP, Bis (4-hydroxyphenyl) dimethylmethane, Bis (4-hydroxyphenyl) propane, Phenol, 4,4'-(1-methylethylidene)bis- |
Typical Product Specifications
| Density | 1.195 (2525 c) |
| Slightly Soluble | in ccl4 |
| Melting Point | 153 c |
| pH | nolic odor |
| Vapor Pressure | 0.2 mm hg (170 c) |
| Water | <= 0.150% wt. |
| Molten Color, APHA | <= 40 |
| Phenol | < 100 wt-ppm |
| Purity | >= 99.80% wt. |
| Freezing Point | >= 156.5C |
| Methanol Color, APHA | <= 20 |
| Iron | <= 0.50 wt-ppm |
| Ash | < 20 wt-ppm |
| Insolubility | in water |
| Molecular weight | 228.31 |
| Flash Point | 79.4 c |
| Solubility | oxygenated solvs., alcohol, aq. alkaline solns., acetic acid, benzene, ketones |
| Boiling Point | 220 c (4 mm) |
| Chemical Structure |  |
| Notes | Phenolic resin comonomer; intermediate in mfg. of polymers, epoxy, polycarbonate, phenoxy, polysulfone, polyetherimide, polyarylate, and polyester resins, flame retardants, rubber chemicals, fungicides, antioxidants, dyes; hard resin for finished prods. incl. laminates, powder coatings, bondable coatings, molding powds.; in food-pkg. adhesives; curing system additive for bisphenol A-epichlorohydrin epoxies for food contact. |
| Class | Adhesives, Coatings and Sealants Chemicals, Toxic Release Inventory (TRI) Chemicals |
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