2,6-Dimethylpiperidine
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Product Description
Product
2,6-Dimethylpiperidine
CAS
504-03-0
Formula
C7H15N
Synonym
cis-2,6-Dimethylpiperidine; 2,6-DIMETHYLPIPERIDINE; 2,6-Lupetidine; 26LPT; AKOS BBS-00000942; 2,6-dimethyl-piperidin; Lupetidin; Lupetidine; Naniopinum; Nanofin; Nanophin; Nanophine; Nanophyn; Naonphyn Piperidine, 2,6-dimethyl-; NSC 63890; Piperidine, 2,6-dimethyl-; TIMTEC-BB SBB004313
Typical Product Specifications
Molecular weight
113.20
EINECS
207-981-6
InChI
1S/C7H15N/c1-6-4-3-5-7(2)8-6/h6-8H,3-5H2,1-2H3
InChIKey
SDGKUVSVPIIUCF-UHFFFAOYSA-N
log P (octanol-water)
2.020
Boiling Point
127 ° C
Atmospheric OH Rate Constant
1.12E-10 cm3/molecule-sec
Storage Temperature
Flammables area
Flash Point
53 °F
Density
0.84 g/mL at 25 °C
Boiling Point
127-128 °C768 mm Hg
BRN Number
79827
Refractive Index
1.4394
Water solubility
MISCIBLE
Sensitive
Air Sensitive
Melting Point
<-20°C
Notes
2,6-Dimethylpiperidine uses and applications include: Intermediate for pharmaceuticals; catalyst for polymerizations; surface treating agent for copper in printed circuits
Class
Industry
Functions
2,6-Dimethylpiperidine
Product Description
Product
2,6-Dimethylpiperidine
CAS
504-03-0
Formula
C7H15N
Synonym
cis-2,6-Dimethylpiperidine; 2,6-DIMETHYLPIPERIDINE; 2,6-Lupetidine; 26LPT; AKOS BBS-00000942; 2,6-dimethyl-piperidin; Lupetidin; Lupetidine; Naniopinum; Nanofin; Nanophin; Nanophine; Nanophyn; Naonphyn Piperidine, 2,6-dimethyl-; NSC 63890; Piperidine, 2,6-dimethyl-; TIMTEC-BB SBB004313
Typical Product Specifications
Molecular weight
113.20
EINECS
207-981-6
InChI
1S/C7H15N/c1-6-4-3-5-7(2)8-6/h6-8H,3-5H2,1-2H3
InChIKey
SDGKUVSVPIIUCF-UHFFFAOYSA-N
log P (octanol-water)
2.020
Boiling Point
127 ° C
Atmospheric OH Rate Constant
1.12E-10 cm3/molecule-sec
Storage Temperature
Flammables area
Flash Point
53 °F
Density
0.84 g/mL at 25 °C
Boiling Point
127-128 °C768 mm Hg
BRN Number
79827
Refractive Index
1.4394
Water solubility
MISCIBLE
Sensitive
Air Sensitive
Melting Point
<-20°C
Notes
2,6-Dimethylpiperidine uses and applications include: Intermediate for pharmaceuticals; catalyst for polymerizations; surface treating agent for copper in printed circuits
Class
Industry
Functions
